骁龙888是高通旗下最新的旗舰芯片，高通骁龙888 5G 移动平台在 5G、AI、游戏、摄影等方面均有大幅性能提升。Snapdragon 888 5G 采用全新的的第 6 代高通人工智能 （AI） 引擎，可提供 26 TOPS 算力支持。支持全球 5G 和业界领先的 Wi-Fi 6，连接突飞猛进。Snapdragon X60 5G 调制解调器 RF 和高通 FastConnect 6900 连接系统都带来了前所未有的性能和可靠性。骁龙888 使用三重 ISP 以多千像素的速度同时从三个镜头中捕获。此外，还使用计算 HDR 录制令人难以置信的 4K HDR 视频 ，将多个镜头合并为一个镜头，获得最高质量的结果。
Features
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Qualcomm® Adreno™ 660 GPU delivers 35% faster graphics rendering
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New architecture based on Arm Cortex-X1 technology
- Qualcomm® Kryo™ 680 CPU enables 25% higher performance and incredible power efficiency
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6th generation Qualcomm AI Engine with Hexagon 780 Processor
- 3X performance per Watt improvement
- Delivers up to 1,000x improvement for hands-off time in certain use-cases
- 2nd Gen Qualcomm® Sensing Hub with always-on low-power AI processor
- 26 TOPS
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Capture 120FPS burst photo at 12MP
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First 4K HDR with computational HDR video capture
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Capture in near darkness with new low light architecture
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First AI-based auto-focus and auto-exposure
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Full suite of Snapdragon Elite Gaming™ features including
- Variable Rate Shading for 30% performance increase
- Qualcomm Game Quick Touch increases responsiveness by up to 20%
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FastConnect 6900 Mobile Connectivity System brings the fastest Wi-Fi 6 speeds of any mobile Wi-Fi offering in the industry (Up to 3.6 Gbps)
- Reimagined Bluetooth audio for a new class of crisp, reliable and responsive voice and music
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Compatible with both standalone and non-standalone modes
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World’s First CAI Compliant Camera – ensure the security & validity of images
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First Snapdragon to feature Qualcomm® Hypervisor Execution Environment: run multiple OSes simultaneously and securely
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Qualcomm® Quick Charge™ 5 technology is 70% more efficient and supports 0-100% charging in less than 15 minutes*
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The Qualcomm Aqstic™ smart speaker amplifier (WSA8835) engineered to deliver a whopping 7.3W output power, almost doubling our previous generation of smart speakers, is a small chip with a big sound
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Qualcomm® AI-Enhanced Signal Boost adaptive antenna tuning
Specifications
Qualcomm® Artificial Intelligence (AI) Engine
AIE GPU: Qualcomm® Adreno™ 660 GPU
AIE CPU: Qualcomm® Kryo™ 680 CPU
Hexagon Processor: Qualcomm® Hexagon™ 780 Processor; 2nd gen Qualcomm® Sensing Hub, Large shared AI memory, Qualcomm® Hexagon™ Voice Assistant Accelerator, Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Hexagon™ Vector eXtensions (HVX), Qualcomm® Hexagon™ Tensor Accelerator
Cellular Modem
Modem Name: Qualcomm® Snapdragon™ X60 5G Modem-RF System
Peak Download Speed: 7.5 Gbps
Peak Upload Speed: 3 Gbps
Performance Enhancement Technologies: Qualcomm® AI-Enhanced Signal Boost adaptive antenna tuning, Qualcomm® Wideband Envelope Tracking, Qualcomm® Smart Transmit™ technology, Qualcomm® 5G PowerSave
5G Spectrum: Dynamic Spectrum Sharing (DSS), mmWave, sub-6 GHz
5G mmWave specs: 800 MHz bandwidth, 8 carriers, 2×2 MIMO
5G sub-6 GHz specs: 200 MHz bandwidth, 4×4 MIMO
Multi-SIM features: Global 5G multi-SIM
Cellular Technology: 5G NR, LTE including CBRS support, HSPA, WCDMA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
5G Downlink speed: Up to 7.5 Gbps
Wi-Fi
Wi-Fi Standards: Wi-Fi 6E, Wi-Fi 6, Wi-Fi 5, 802.11a/b/g, 802.11n
Qualcomm® Wi-Fi 6 technology features: 160 MHz channel support, MU-MIMO (Uplink and Downlink), 8×8 sounding, 4K QAM, OFDMA (Uplink and Downlink), WPA3 security support, 6 GHz operation (Wi-Fi 6E)
Wi-Fi Spectral Bands: 2.4GHz, 5GHz, 6GHz
Bluetooth
Bluetooth Audio: Qualcomm® aptX™ Adaptive Audio, LE Audio Features, Qualcomm TrueWireless™ Technology, Bluetooth 5.2
NFC
Near Field Communications: Supported
Location
Satellite Systems Support: Beidou, Galileo, GLONASS, Dual frequency GNSS, NavIC, NavIC enabled, GPS, GNSS, QZSS, SBAS
USB
USB Version: USB 3.1, USB-C
CPU
CPU Clock Speed: Up to 2.84 GHz
CPU Architecture: 64-bit
Process
Process Technology: 5 nm
Qualcomm® FastConnect™ Subsystem
Wi-Fi/Bluetooth Subsystem: Qualcomm® FastConnect™ 6900
Bluetooth Features: Qualcomm® aptX™ Voice, Qualcomm® TrueWireless™ Technology, Bluetooth 5.2, LE Audio Features (broadcast audio), Qualcomm® aptX™ Adaptive Audio, Dual Bluetooth Antennas
Wi-Fi 6 features: 6 GHz operation (Wi-Fi 6E), MU-MIMO (Uplink and Downlink), 8×8 sounding, 4K QAM, OFDMA (Uplink and Downlink), WPA3 security support, 4-Stream Dual-band simultaneous, Dual-band simultaneous (DBS), 160 MHz channel support, Target Wake Time
Camera
Image Signal Processor: Qualcomm Spectra™ 580 image signal processor, Triple 14-bit CV-ISPs, Hardware accelerator for computer vision (CV-ISP)
Dual Camera, MFNR, ZSL, 30fps: Up to 64 MP
Triple Camera, MFNR,, 30fps, ZSL: Up to 28 MP
Single Camera, MFNR, ZSL, 30fps: Up to 84 MP
Single Camera: Up to 200 MP
Camera Features: Real-time object classification, Low light photography architecture, 10-bit HDR HEIF photo capture, Multi-frame Noise Reduction (MFNR)
Slow Motion Video Capture: 720p @ 960 FPS
Video Capture Formats: Dolby Vision, HDR10, HDR10+, HEVC
Video Capture Features: Rec. 2020 color gamut video capture, 4K HDR with Computational HD, 8K video capture at 30fps, Up to 10-bit color depth video capture
Video
Codec Support: Dolby Vision, H.265 (HEVC), HDR10+, HLG, HDR10, H.264 (AVC), VP8, VP9
Display
Max On-Device Display: 4K @ 60 Hz, QHD+ @ 144 Hz
Display Features: Demura and subpixel rendering for OLED uniformity
Max External Display: 4K @ 60 Hz
HDR: HDR10+, HLG, Dolby Vision, HDR10
Color Depth: Up to 10-bit
Color Gamut: Rec2020
General Audio
Audio Technology: Qualcomm Aqstic™ smart speaker amplifier up to Qualcomm® WSA8835, Qualcomm® Hexagon™ Voice Assistant Accelerator, Qualcomm Aqstic™ audio codec up to Qualcomm® WCD9385, Qualcomm Aqstic™ audio technology
GPU
GPU Video Playback: Volumetric VR video playback, 8K 360 VR video playback
API Support: OpenCL™ 2.0 FP, OpenGL® ES 3.2, Vulkan® 1.1, DX12
Security Support
Fingerprint Sensor: Qualcomm® 3D Sonic, Qualcomm® 3D Sonic Max
Secure Processing Unit: Biometric Authentication (Fingerprint, Iris, Voice, Face)
