超恩股份有限公司 (Vecow，富士康旗下成员，以下简称超恩)推出了基于Intel Whiskey Lake处理器和Hailo-8加速处理器的AI边缘计算解决方案- ABP-3000 AI嵌入式系统。系统部分采用低功耗的核心处理器，搭载的Hailo-8AI人工智能加速器，可提供高达52TPOS的算力支持，可以满足复杂机器视觉的应用需求。可用于机器视觉、车载应用、机器人控制、公众安全以及任何Edge AI边缘计算应用需求。
超恩ABP-3000 AI嵌入式系统采用第8代Intel® Core i7/i5/i3处理器，可弹性搭载Hailo-8 AI加速器，每个可提供高达26TOPS的算力支持，可充分满足满足 AI 应用程序的需求。此外，ABP-3000 AI 还配备了多个接口，包括高达 4K 分辨率的双独立显示端口显示屏、4 个端口 USB 3.1、4 个 GigE 局域网和 2 个 PoE+ 和 4 个 COM 端口。APB-3000 AI 具有 0°C 至 60°C 和 9V 至 50V 功率输入的扩展工作温度范围，是机器视觉、车载计算、ARM/AGV 和智能控制应用程序或任何行业 4.0/AIoT 应用程序的可信解决方案。
在多种AI人工智能类神经网路计算平台的验证测试中，超恩ABP-3000 AI嵌入式系统展现了优越的AI推论 (Inference) 性能，以及最高25W的系统功耗表现：在Resnet-50平台上，最高每秒传输帧数可达3000帧 (FPS)；在Mobilenet-V1 SSD平台上，最高每秒传输帧数可达2500帧 (FPS)；在Yolo-v5m平台上，最高每秒传输帧数可达450帧 (FPS)；在Yolo-v3平台上，最高每秒传输帧数可达230帧 (FPS)。
ABP-3000 AI 外观
ABP-3000 AI 特色
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- 8th Generation Intel® Core™ U-series processor (Whiskey Lake) supports up to 40% greater productivity than former generation
- Ultra-slim and cableless design supports wide range temperature of 0°C to 60°C with fanless operation
- Advanced AI Accelerator supports up to 26 Tera-Operations Per Second (TOPS) with best-in-class power efficiency of 3 TOPS/W
- 2 DDR4 2400MHz memory, up to 64GB
- 4-port USB 3.1 support up to 10Gbps data transfer
- 4 Independent GigE LAN with 2 IEEE 802.3at PoE+
- SIM Socket for 5G/WiFi/4G/3G/LTE/GPRS/UMTS
- 4 COM RS-232/422/485, 16 Isolated DIO
- 9V to 50V DC wide range Power Input
- Ignition Power Control, TPM 2.0
- Expansion : M.2 Key B, M.2 Key E and Mini PCIe
- Optional VHub One-Stop AIoT Solution Service supports OpenVINO based AI accelerator and advanced Edge AI applications
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ABP-3000 AI主要规格
| System | |
| Processor | Quad Core Intel® Core™ i7-8665UE/i3-8145UE Processor (Whiskey Lake) |
| Chipset | Intel® SoC (Cannon Lake) |
| BIOS | AMI |
| SIO | IT8786E |
| Memory | 2 DDR4 2400MHz SO-DIMM, up to 64GB |
| AI Accelerator | |
| Processor | Hailo-8™ AI Processor, up to 26 TOPS |
| Framework | TensorFlow, ONNX |
| I/O Interface | |
| Serial | 4 COM RS-232/422/485 (ESD 8kV) |
| USB | 4 USB 3.1 (External) |
| Isolated DIO | 16 Isolated DIO : 8 DI, 8 DO |
| LED | HDD, PoE+ |
| SIM Card | 2 Internal SIM Card Socket |
| Expansion | |
| M.2 |
-1 M.2 Key E Socket (PCIe x1)
-1 M.2 Key B Socket (PCIe x2/USB 3.1)
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| Mini PCIe | 1 Mini PCIe Socket for PCIe/USB/SIM Card |
| Graphics | |
| Graphics Processor | Intel® UHD Graphics 620 |
| Interface | 2 DisplayPort : Up to 4096 x 2304 @60Hz |
| Storage | |
| M.2 | 1 M.2 Key B Socket (PCIe x2/SATA) |
| Audio | |
| Audio Codec | Realtek ALC888S-VD, 7.1 Channel HD Audio |
| Audio Interface | 1 Mic-in, 1 Line-out |
| Ethernet | |
| LAN 1 | GigE LAN by Intel® Ethernet Controller I350 |
| LAN 2 | GigE LAN by Intel® Ethernet Controller I350 |
| PoE | |
| LAN 3 | GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I350 with Power On/Off Control |
| LAN 4 | GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I350 with Power On/Off Control |
| Power | |
| Power Input | DC 9V to 50V |
| Power Interface | Mini DIN |
| Ignition Control | 16 Mode |
| Remote Switch | 3-pin Terminal Block : On, Off, IGN |
| Others | |
| TPM | Optional Infineon SLB9665 supports TPM 2.0, LPC Interface |
| Watchdog Timer | Reset : 1 to 255 sec./min. per step |
| Smart Management | Wake on LAN, PXE supported |
| HW Monitor | Monitoring temperature, voltages. Auto throttling control when CPU overheats. |
| Software Support | |
| OS | Windows 10, Linux |
| Mechanical | |
| Dimension (W x L x H) | 224.0mm x 149.0mm x 32.6mm (8.82″ x 5.87″ x 1.28″) |
| Weight | 1.4 kg (3.09 lb) |
| Environment | |
| Operating Temperature | 0°C to 60°C (-32°F to 140°F) |
| Storage Temperature | 0°C to 70°C (-32°F to 158°F) |
| Humidity | 5% to 95% Humidity, non-condensing |
| Relative Humidity | 95% @60°C |
| Shock |
– IEC 60068-2-27
– SSD : 50G @ wallmount, Half-sine, 11ms
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| Vibration |
– IEC 60068-2-64
– SSD : 5Grms, 5Hz to 500Hz, 3 Axis
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| EMC | CE, FCC, EN50155, EN50121-3-2 |
